Processor |
Processor generation |
3rd Generation Intel® Xeon® Scalable |
Processor base frequency |
3.2 GHz |
Processor manufacturer |
Intel |
Cooler included |
No |
Processor codename |
Ice Lake |
Thermal Design Power (TDP) |
140 W |
Processor cache |
12 MB |
Processor model |
5315Y |
Processor threads |
16 |
System bus rate |
11.2 GT/s |
Processor operating modes |
64-bit |
Processor boost frequency |
3.6 GHz |
Component for |
Server/workstation |
Processor lithography |
10 nm |
Processor family |
Intel® Xeon® Gold |
Processor cores |
8 |
Box |
No |
Processor socket |
LGA 4189 |
Processor series |
Intel Xeon Gold 5000 Series |
Memory |
Memory types supported by processor |
DDR4-SDRAM |
Supported memory types |
DDR4-SDRAM |
Memory channels |
Octa-channel |
ECC |
Yes |
Graphics |
Discrete graphics card |
No |
On-board graphics card model |
Not available |
On-board graphics card |
No |
Discrete graphics card model |
Not available |
Power |
Thermal Design Power (TDP) |
140 W |
Technical details |
Intel® Turbo Boost Technology |
2.0 |
Intel Trusted Execution Technology |
Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) |
Yes |
Intel® AES New Instructions (Intel® AES-NI) |
Yes |
Execute Disable Bit |
Yes |
PCI Express slots version |
4.0 |
Supported instruction sets |
SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability |
2S |
Intel VT-x with Extended Page Tables (EPT) |
Yes |
Embedded options available |
Yes |
Intel Virtualization Technology for Directed I/O (VT-d) |
Yes |
Intel 64 |
Yes |
Thermal Design Power (TDP) |
140 W |
Supported memory types |
DDR4-SDRAM |
Status |
Launched |
Processor series |
Intel Xeon Gold 5000 Series |
Market segment |
Server |
Launch date |
Q2’21 |
Intel Virtualization Technology (VT-x) |
Yes |
Number of UPI links |
3 |
Memory speed (max) |
2933 MHz |
AVX-512 Fused Multiply-Add (FMA) units |
2 |
Target market |
Cloud Computing |
Features |
Maximum number of PCI Express lanes |
64 |
Thermal Design Power (TDP) |
140 W |
Processor package size |
77.5 x 56.5 mm |
Execute Disable Bit |
Yes |
PCI Express slots version |
4.0 |
Supported instruction sets |
SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability |
2S |
Embedded options available |
Yes |
Market segment |
Server |
Harmonized System (HS) code |
85423119 |
Export Control Classification Number (ECCN) |
5A992CN3 |
Commodity Classification Automated Tracking System (CCATS) |
G178966 |
Processor special features |
Intel Software Guard Extensions (Intel SGX) |
Yes |
Intel Virtualization Technology for Directed I/O (VT-d) |
Yes |
Intel 64 |
Yes |
Intel® Speed Shift Technology |
Yes |
Intel® Turbo Boost Technology |
2.0 |
Intel Trusted Execution Technology |
Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) |
Yes |
Intel® AES New Instructions (Intel® AES-NI) |
Yes |
Intel VT-x with Extended Page Tables (EPT) |
Yes |
Intel Virtualization Technology (VT-x) |
Yes |
AVX-512 Fused Multiply-Add (FMA) units |
2 |
Intel® Volume Management Device (VMD) |
Yes |
Intel® Speed Select technology – Performance Profile (Intel® SST-PP) |
Yes |
Intel® Optane™ DC Persistent Memory Supported |
Yes |
Intel® Deep Learning Boost (Intel® DL Boost) |
Yes |
Mode-based Execute Control (MBE) |
Yes |
Intel® Run Sure Technology |
Yes |
Intel® Resource Director Technology (Intel® RDT) |
Yes |
Intel® Transactional Synchronization Extensions |
Yes |
Intel® Total Memory Encryption |
Yes |
Maximum Enclave Size Support for Intel® SGX |
64 GB |
Intel® Platform Firmware Resilience Support |
Yes |
Intel® Crypto Acceleration |
Yes |
Operational conditions |
Tcase |
81 °C |
Logistics data |
Harmonized System (HS) code |
85423119 |
Weight & dimensions |
Processor package size |
77.5 x 56.5 mm |
Other features |
Maximum internal memory |
6 TB |